JPH0446478B2 - - Google Patents

Info

Publication number
JPH0446478B2
JPH0446478B2 JP59156426A JP15642684A JPH0446478B2 JP H0446478 B2 JPH0446478 B2 JP H0446478B2 JP 59156426 A JP59156426 A JP 59156426A JP 15642684 A JP15642684 A JP 15642684A JP H0446478 B2 JPH0446478 B2 JP H0446478B2
Authority
JP
Japan
Prior art keywords
metal plate
hole
substrate
board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59156426A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6134990A (ja
Inventor
Hajime Yatsu
Katsumi Mabuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP15642684A priority Critical patent/JPS6134990A/ja
Publication of JPS6134990A publication Critical patent/JPS6134990A/ja
Publication of JPH0446478B2 publication Critical patent/JPH0446478B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Die Bonding (AREA)
JP15642684A 1984-07-25 1984-07-25 電子部品搭載用基板およびその製造方法 Granted JPS6134990A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15642684A JPS6134990A (ja) 1984-07-25 1984-07-25 電子部品搭載用基板およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15642684A JPS6134990A (ja) 1984-07-25 1984-07-25 電子部品搭載用基板およびその製造方法

Publications (2)

Publication Number Publication Date
JPS6134990A JPS6134990A (ja) 1986-02-19
JPH0446478B2 true JPH0446478B2 (en]) 1992-07-30

Family

ID=15627485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15642684A Granted JPS6134990A (ja) 1984-07-25 1984-07-25 電子部品搭載用基板およびその製造方法

Country Status (1)

Country Link
JP (1) JPS6134990A (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007036050A (ja) * 2005-07-28 2007-02-08 Shin Kobe Electric Mach Co Ltd 積層回路基板の製造方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0685464B2 (ja) * 1984-09-06 1994-10-26 イビデン株式会社 電子部品搭載用基板の製造方法
JPH0810708B2 (ja) * 1987-04-20 1996-01-31 松下電器産業株式会社 プリント配線板
JPS6439093A (en) * 1987-08-05 1989-02-09 Matsushita Electric Works Ltd Manufacture of electronic part mounting board
US5006923A (en) * 1989-09-14 1991-04-09 Litton Systems, Inc. Stackable multilayer substrate for mounting integrated circuits
JP2813682B2 (ja) * 1989-11-09 1998-10-22 イビデン株式会社 電子部品搭載用基板
JPH0379440U (en]) * 1989-12-01 1991-08-13
JPH04192551A (ja) * 1990-11-27 1992-07-10 Matsushita Electric Works Ltd 半導体チップキャリア

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60111489A (ja) * 1983-11-21 1985-06-17 イビデン株式会社 電子部品塔載用基板およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007036050A (ja) * 2005-07-28 2007-02-08 Shin Kobe Electric Mach Co Ltd 積層回路基板の製造方法

Also Published As

Publication number Publication date
JPS6134990A (ja) 1986-02-19

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term